Platinum-chip temperature sensors SMDFCB-L-AuNi

In SMD design type (flip chip) with metallized back cover according to DIN EN IEC 60751

Platinum chip temperature sensors belong to the category of temperature sensors that were made using thin-film technology. Sensors of the SMDFCB design type have a single-sided contact (flip chip) and are equipped with a solderable nickel-gold metallization on the back cover. The metal layer enables direct thermal contact with another body via a solder connection.

 

chip check circle dimension
Solderable metallized
back cover
For confined
spaces
SMD size SMD
0805

 

GENERAL TECHNICAL DATA

 
Design type SMDFCB-L-AuNi
Standard DIN EN IEC 60751
Temperature range -70 to +250 °C
Temperature coefficient α = 3.850 × 10-3 °C-1 (between 0 and 100 °C)
Connection 2 LCD displays with 18 segments each including display of texts (not with JUMO meroVIEW 116), plain text display for menu, parameters, and process information
Connections Gold-plated nickel solder contact, thickness of nickel layer ≥ 1 µm, gold ≥ 40 nm, solderability according to IEC / DIN EN 60068-2-58
Processing Reflow soldering
Metallized back cover Nickel/gold
Advantages Solderable back cover for better thermal contact, for confined spaces, SMD size 0805, single side contact (flip chip design type), high-purity and even contact layer for better solder connection, high measuring accuracy, high long-term stability, standardized nominal values and tolerances, fast response behavior
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chip check circle temperature
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